Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/10/2013
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Application #:
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12709291
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Filing Dt:
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02/19/2010
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Publication #:
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Pub Dt:
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08/26/2010
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Inventors:
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Hon Shing Lau, Shi-Wei Lee, Matthew Ming Fai Yuen, Jingshen Wu, Chi Chuen Lo, Haibo Fan et al
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Title:
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APPARATUS HAVING THERMAL-ENHANCED AND COST-EFFECTIVE 3D IC INTEGRATION STRUCTURE WITH THROUGH SILICON VIA INTERPOSERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CLEAR WATER BAY, KOWLOON |
| HONG KONG, CHINA |
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| JOHN B. CONKLIN |
| 180 N. STETSON AVE. SUITE 4900 |
| 705985 |
| CHICAGO, IL 60601-6731 |
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