Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/17/2013
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Application #:
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11407079
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Filing Dt:
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04/20/2006
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Publication #:
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Pub Dt:
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04/05/2007
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Inventors:
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Daisuke Hayashi, Akira Muramatsu
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Title:
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Sealing part and substrate processing apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6, AKASAKA 5-CHOME, MINATO-KU |
| TOKYO 107-8481, JAPAN |
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| 1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU |
| TOKYO 163-0406, JAPAN |
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| C. IRVIN MCCLELLAND |
| OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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| 1-1 OSAKI 2-CHOME SHINAGAWA-KU |
| TOKYO, JAPAN 141-6024 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1-1 OSAKI 2-CHOME SHINAGAWA-KU |
| TOKYO, JAPAN 141-6024 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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