Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/24/2013
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Application #:
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13286094
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Filing Dt:
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10/31/2011
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Publication #:
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Pub Dt:
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03/28/2013
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Inventor:
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JUN YANG
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Title:
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SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MAKING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.,ZHONGSHAN TORCH HI-TECH DEVELOPMENT ZONE |
| ZHONGSHAN CITY, GUANGDONG PROVINCE, CHINA |
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| 66,CHUNG SHAN ROAD |
| TU-CHENG, NEW TAIPEI, TAIWAN |
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| RAYMOND J. CHEW |
| 288 SOUTH MAYO AVENUE |
| CITY OF INDUSTRY, CA 91789 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.,ZHONGSHAN TORCH HI-TECH DEVELOPMENT ZONE |
| ZHONGSHAN, CHINA |
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| RAYMOND J. CHEW |
| 1203 W. IMPERIAL HWY SUITE 100 |
| BREA, CA 92821 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO.9 JIANYE EAST ROAD,,ZHONGSHAN TORCH DEVELOPMENT ZONE |
| ZHONGSHAN, CHINA |
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| ZHIGANG MA |
| 1000 LOUISIANA STREET, FIFTY-THIRD FLOOR |
| HOUSTON, TX 77002 |
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