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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	8623733	Issue Dt:	01/07/2014	Application #:	12755259	Filing Dt:	04/06/2010
Publication #:	20100267235	Pub Dt:	10/21/2010
Inventors:	Feng Chen, Raashina Humayun, Michal Danek, Anand Chandrashekar
Title:	METHODS FOR DEPOSITING ULTRA THIN LOW RESISTIVITY TUNGSTEN FILM FOR SMALL CRITICAL DIMENSION CONTACTS AND INTERCONNECTS

Assignment: 1

Reel/Frame:

024194/0169

Recorded: 04/06/2010

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

CHEN, FENG

Exec Dt:

04/02/2010

HUMAYUN, RAASHINA

Exec Dt:

04/02/2010

DANEK, MICHAL

Exec Dt:

04/02/2010

CHANDRASHEKAR, AMAND

Exec Dt:

04/05/2010

Assignee:

NOVELLUS SYSTEMS, INC.

3970 NORTH FIRST STREET

SAN JOSE, CALIFORNIA 95134

Correspondent:

DENISE BERGIN/WAVS LLP

P.O. BOX 70250

OAKLAND, CA 94612-0250

Assignment: 2

Reel/Frame:

024393/0981

Recorded: 05/17/2010

Pages: 6

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE FOURTH INVENTOR'S NAME FROM AMAND CHANDRASHEKAR TO ANAND CHANDRASHEKAR PREVIOUSLY RECORDED ON REEL 024194 FRAME 0169. ASSIGNOR(S) HEREBY CONFIRMS THE FOURTH INVENTOR'S NAME TO BE ANAND CHANDRASHEKAR.

Assignors:

CHEN, FENG

Exec Dt:

04/02/2010