Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/21/2014
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Application #:
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13243764
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Filing Dt:
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09/23/2011
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Publication #:
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Pub Dt:
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10/04/2012
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Inventor:
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Won Cheol Seo
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Title:
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WAFER LEVEL LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1B-36, 727-5 WONSI-DONG, DANWON-GU |
GYEONGGI-DO |
ANSAN-SI, KOREA, REPUBLIC OF 425-851 |
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H.C. PARK & ASSOCIATES, PLC |
8500 LEESBURG PIKE, SUITE 7500 |
VIENNA, VA 22182 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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65-12 SANDAN-RO, 163BEON-GIL, DANWON-GU |
ANSAN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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DANIEL M. GURFINKEL |
120 SOUTH LASALLE STREET, SUITE 1400 |
CHICAGO, IL 60603 |
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