Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/21/2014
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Application #:
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13344503
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Filing Dt:
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01/05/2012
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Publication #:
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Pub Dt:
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07/11/2013
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Inventors:
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DING-BO LIN, CHIN-WEI HSIEH, SHIH-MIN WU, YEN-FEN CHEN, CHIA-CHI LIU
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Title:
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MULTICHIP PACKAGE STRUCTURE AND LIGHT BULB OF USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5F., NO.212-1, SEC. 3, DATONG RD., XIZHI DIST. |
| NEW TAIPEI CITY, TAIWAN 221 |
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| LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
| 2820 SHAWN LEIGH DR |
| VIENNA, VA 22181 |
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