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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/04/2014
Application #:
13174390
Filing Dt:
06/30/2011
Publication #:
Pub Dt:
01/03/2013
Inventor:
Zhiwei Dong
Title:
HIGH BREAKDOWN VOLTAGE INTEGRATED CIRCUIT ISOLATION STRUCTURE
Assignment: 1
Reel/Frame:
029838/0846Recorded: 02/20/2013Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/14/2003
Assignee:
400 WEST CESAR CHAVEZ
AUSTIN, TEXAS 78701
Correspondent:
MAXIMILIAN R. PETERSON
P.O. BOX 93005
AUSTIN, TX 787093005
Assignment: 2
Reel/Frame:
057033/0579Recorded: 07/29/2021Pages: 56
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/23/2021
Assignee:
5260 CALIFORNIA AVENUE
IRVINE, CALIFORNIA 92617
Correspondent:
DONALD BOLLELLA
5221 CALIFORNIA AVENUE, 21-1
IRVINE, CA 92617

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