Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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13311364
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Filing Dt:
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12/05/2011
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Publication #:
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Pub Dt:
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07/12/2012
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Inventors:
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Chia-Lin Hung, Jen-Chuan Chen, Hui-Shan Chang, Kuo-Pin Yang
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Title:
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SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS AND METHOD FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| GEORGE D. MORGAN |
| 4635 S. LAKESHORE DR., SUITE 131 |
| TEMPE, AZ 85282 |
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