Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/04/2014
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Application #:
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13060097
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Filing Dt:
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02/22/2011
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Publication #:
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Pub Dt:
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02/14/2013
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Inventor:
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Kyoung-Min Kim
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Title:
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TERMINAL-INTEGRATED METAL BASE PACKAGE MODULE AND TERMINAL-INTEGRATED METAL BASE PACKAGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2305, SEMICONDUCTOR-DONG, KAIST, GUSEONG-DONG, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 305-701 |
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| LEXYOUME IP GROUP, PLLC |
| 5180 PARKSTONE DRIVE, SUITE 175 |
| CHANTILLY, VA 20151 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2305, SEMICONDUCTOR-DONG, KAIST, GUSEONG-DONG, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 305-701 |
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| (GOMAE-DONG) 12, WONGOMAE-RO, GIHEUNG-GU, GYEONGGI-DO |
| YONGIN-SI, KOREA, REPUBLIC OF 135-010 |
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| LEXYOUME IP MEISTER, PLLC |
| 5180 PARKSTONE DRIVE, SUITE 175 |
| CHANTILLY, VA 20151 |
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