Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/25/2014
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Application #:
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11361640
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Filing Dt:
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02/24/2006
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Publication #:
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Pub Dt:
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08/24/2006
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Inventors:
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Tatsunari Mii, Toshihiko Toyama
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Title:
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Wire bonding method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-51-1, INADAIRA |
| MUSASHIMURAYAMA-SHI, TOKYO, JAPAN |
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| WILLIAM L. ANDROLIA |
| KODA & ANDROLIA |
| 2029 CENTURY PARK EAST, SUITE 1140 |
| LOS ANGELES, CALIFORNIA 90067-2983 |
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