Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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04/29/2014
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Application #:
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14019136
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Filing Dt:
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09/05/2013
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Inventors:
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Ronald Patrick Huemoeller, David Razu, Sukianto Rusli
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Title:
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WAFER LEVEL PACKAGE AND FABRICATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1900 SOUTH PRICE ROAD |
CHANDLER, ARIZONA 85248 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 W. MADISON ST |
34TH FLOOR |
CHICAGO, IL 60661 |
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Assignment:
2
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PATENT SECURITY AGREEMENT
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901 MAIN STREET, 11TH FLOOR |
DALLAS, TEXAS 75202 |
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STEPHEN P. DEMM - HUNTON & WILLIAMS LLP |
951 EAST BYRD STREET |
RIVERFRONT PLAZA - EAST TOWER |
RICHMOND, VA 23219-4074 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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333 SOUTH HOPE STREET |
19TH FLOOR |
LOS ANGELES, CALIFORNIA 90071 |
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MCGUIREWOODS LLP |
1750 TYSONS BOULEVARD |
SUITE 1800 |
TYSONS, VA 22102 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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491 B RIVER VALLEY ROAD |
#15-02/04 |
VALLEY POINT, SINGAPORE 248373 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON STREET |
34TH FLOOR |
CHICAGO, IL 60661 |
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