Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/29/2014
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Application #:
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13567046
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Filing Dt:
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08/04/2012
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Publication #:
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Pub Dt:
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06/13/2013
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Inventors:
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Hee-Jin LEE, Woo-Dong LEE
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Title:
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MULTI-CHIP PACKAGE WITH A SUPPORTING MEMBER AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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129, SAMSUNG-RO, YEONGTONG-GU, |
SUWON-SI, KOREA, REPUBLIC OF |
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RENAISSANCE IP LAW GROUP LLP (PIP) |
9600 SW OAK ST. SUITE 560 |
PORTLAND, OR 97223 |
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