Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/13/2014
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Application #:
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13666792
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Filing Dt:
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11/01/2012
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Publication #:
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Pub Dt:
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05/01/2014
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Inventors:
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Yu-Hung Lin, Chi-Yu Chou, Kuei-Pin Lee, Chen-Kuang Lien, Yu-Chang Hsiao, Yao-Hsiang Liang et al
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Title:
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BARRIER LAYER FOR COPPER INTERCONNECT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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SLATER & MATSIL, L.L.P. |
17950 PRESTON ROAD |
SUITE 1000 |
DALLAS, TX 75252 |
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