Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/20/2014
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Application #:
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13225756
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Filing Dt:
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09/06/2011
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Publication #:
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Pub Dt:
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12/29/2011
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Inventors:
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Yu-Pin TSAI, Cheng-I Huang, Yao-Hui Hu
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Title:
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WAFER LASER-MARKING METHOD AND DIE FABRICATED USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 26, JINGSAN RD., NANTZ CHIU |
KAOSIUNG, TAIWAN 811 |
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MUNCY, GEISSLER, OLDS & LOWE, PLLC |
4000 LEGATO ROAD |
SUITE 310 |
FAIRFAX, VA 22033 |
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