Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
06/17/2014
|
Application #:
|
13419451
|
Filing Dt:
|
03/14/2012
|
Publication #:
|
|
Pub Dt:
|
09/19/2013
| | | | |
Inventors:
|
Yu-Shan Chiu, Kuo-Hui Su
|
Title:
|
THROUGH-SILICON VIA WITH A NON-CONTINUOUS DIELECTRIC LAYER
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
HWA-YA TECHNOLOGY PARK 669, FUHSING 3 RD., KUEISHAN |
TAO-YUAN HSIEN, TAIWAN |
|
|
|
WINSTON HSU |
P.O.BOX 506 |
MERRIFIELD, VA 22116 |
|
|
Search Results as of:
09/23/2024 08:17 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|