Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/01/2014
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Application #:
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13457995
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Filing Dt:
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04/27/2012
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Publication #:
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Pub Dt:
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09/12/2013
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Inventors:
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Tsung-Hsien Hsu, Hsin-Lung Chung, Hao-Ju Fang
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Title:
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SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
TAICHUNG, TAIWAN |
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EDWARDS WILDMAN PALMER LLP |
P.O. BOX 55874 |
BOSTON, MA 02205 |
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