Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/15/2014
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Application #:
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13931854
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Filing Dt:
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06/29/2013
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Inventors:
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Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Ping Huang, Lei Shi, Lei Duan, Yuping Gong
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Title:
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PACKAGING METHOD OF MOLDED WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 475 OAKMEAD PKWY, |
| SUNNYVALE, CALIFORNIA 94085 |
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| CHEIN-HWA S. TSAO |
| 6684 MT PAKRON DRIVE |
| SAN JOSE, CA 95120 |
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