Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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13678507
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Filing Dt:
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11/15/2012
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Publication #:
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Pub Dt:
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05/16/2013
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Inventors:
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Tsang-Yu LIU, Chia-Ming CHENG
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Title:
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CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
JHONGLI CITY, TAOYUAN COUNTY, TAIWAN 32062 |
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WEN LIU |
350 S. FIGUEROA STREET, SUITE 975 |
LOS ANGELES, CA 90071 |
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