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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/19/2014
Application #:
12811038
Filing Dt:
10/04/2010
Publication #:
Pub Dt:
02/17/2011
Inventors:
Tomoyuki Takada, Sadanori Yamanaka, Masahiko Hata
Title:
SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND ELECTRONIC DEVICE
Assignment: 1
Reel/Frame:
025087/0410Recorded: 10/04/2010Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/09/2010
Exec Dt:
07/12/2010
Exec Dt:
07/09/2010
Assignee:
27-1, SHINKAWA 2-CHOME
CHUO-KU, TOKYO, JAPAN 104-8260
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVE.
NW
WASHINGTON, DC 20037

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