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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/19/2014
Application #:
13565553
Filing Dt:
08/02/2012
Publication #:
Pub Dt:
02/06/2014
Inventor:
Shin-Dar Jan
Title:
SUBSTRATE CONNECTION TYPE MODULE STRUCTURE
Assignment: 1
Reel/Frame:
028713/0099Recorded: 08/02/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/18/2012
Assignee:
NO. 159, SEC. 1, ZHONGSHAN N. RD.,
YANGMEI CITY, TAOYUAN COUNTY, TAIWAN 326
Correspondent:
SHIMOKAJI & ASSOCIATES, P.C.
8911 RESEARCH DRIVE
IRVINE, CA 92618
Assignment: 2
Reel/Frame:
033634/0968Recorded: 08/28/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/27/2014
Assignee:
22F., NO. 392, RUEY KUANG ROAD, NEIHU DIST.
TAIPEI CITY, TAIWAN
Correspondent:
LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
3057 NUTLEY STREET
SUITE 818
FAIRFAX, VA 22031

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