Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/19/2014
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Application #:
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13565553
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Filing Dt:
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08/02/2012
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Publication #:
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Pub Dt:
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02/06/2014
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Inventor:
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Shin-Dar Jan
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Title:
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SUBSTRATE CONNECTION TYPE MODULE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 159, SEC. 1, ZHONGSHAN N. RD., |
YANGMEI CITY, TAOYUAN COUNTY, TAIWAN 326 |
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SHIMOKAJI & ASSOCIATES, P.C. |
8911 RESEARCH DRIVE |
IRVINE, CA 92618 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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22F., NO. 392, RUEY KUANG ROAD, NEIHU DIST. |
TAIPEI CITY, TAIWAN |
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
3057 NUTLEY STREET |
SUITE 818 |
FAIRFAX, VA 22031 |
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