Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/26/2014
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Application #:
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13101883
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Filing Dt:
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05/05/2011
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Publication #:
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Pub Dt:
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11/08/2012
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Inventors:
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Telesphor Kamgaing, Valluri R. Rao, Yorgos Palaskas
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Title:
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CHIP PACKAGES INCLUDING THROUGH-SILICON VIA DICE WITH VERTICALLY INEGRATED PHASED-ARRAY ANTENNAS AND LOW-FREQUENCY AND POWER DELIVERY SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| INTEL CORPORATION |
| C/O CPA GLOBAL |
| P.O. BOX 52050 |
| MINNEAPOLIS, MN 55402 |
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