Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/02/2014
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Application #:
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13524368
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Filing Dt:
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06/15/2012
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Publication #:
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Pub Dt:
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12/19/2013
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Inventors:
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Mohsen Askarinya, Mark R. Boone, Andreas A. Fenner, Lejun Wang, Kenneth Heames
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Title:
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INTEGRATED CIRCUIT PACKAGING FOR IMPLANTABLE MEDICAL DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 710 MEDTRONIC PARKWAY |
| MAIL STOP LC340 |
| MINNEAPOLIS, MINNESOTA 55432 |
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| EVANS M. MBURU |
| 710 MEDTRONIC PARKWAY |
| MAILSTOP LC340 |
| MINNEAPOLIS, MN 55432 |
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