Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/16/2014
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Application #:
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13754910
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Filing Dt:
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01/31/2013
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Publication #:
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Pub Dt:
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06/06/2013
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Inventors:
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CHAU-CHUN WEN, DA-JUNG CHEN, CHUN-TIAO LIU
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Title:
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ELECTRONIC PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, R&D 2ND RD. SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| MIN-LEE TENG |
| 7F-2, NO. 79, SEC. 2, ROOSEVELT RD. |
| TAIPEI, TAIWAN |
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