Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/30/2014
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Application #:
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13569600
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Filing Dt:
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08/08/2012
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Publication #:
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Pub Dt:
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11/29/2012
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Inventors:
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Jong Hoon KIM, Min Suk SUH, Seung Taek YANG, Seung Hyun LEE, Tae Min KANG
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Title:
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STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2091 GYEONGCHUNGDAE-RO, BUBAL-EUP, INCHEON-SI |
GYEONGGI-DO, KOREA, REPUBLIC OF |
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RICHARD J. STREIT |
LADAS & PARRY, 224 SOUTH MICHIGAN AVE. |
CHICAGO, IL 60604 |
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