Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2014
|
Application #:
|
13774421
|
Filing Dt:
|
02/22/2013
|
|
Publication #:
|
|
Pub Dt:
|
09/12/2013
| | | | |
|
Inventor:
|
Kezia Cheng
|
|
Title:
|
COPPER INTERCONNECTS HAVING A TITANIUM-TITANIUM NITRIDE ASSEMBLY BETWEEN COPPER AND COMPOUND SEMICONDUCTOR
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 20 SYLVAN ROAD |
| WOBURN, MASSACHUSETTS 01801 |
|
|
|
|
| DONALD BOLLELLA |
| 5221 CALIFORNIA AVENUE, 21-1 |
| IRVINE, CA 92617 |
|
|
Search Results as of:
05/23/2024 01:42 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
