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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
11/11/2014
Application #:
12674804
Filing Dt:
11/24/2010
Publication #:
Pub Dt:
04/21/2011
Inventors:
David Van Heerden, Timothy Ryan Rude, Ramzi Vincent
Title:
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
Assignment: 1
Reel/Frame:
024346/0616Recorded: 05/06/2010Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/25/2010
Exec Dt:
03/23/2010
Exec Dt:
03/19/2010
Assignee:
180 LAKE FRONT DRIVE
HUNT VALLEY, MARYLAND 21030
Correspondent:
MARK E. BOOKS
12412 POWERSCOURT DRIVE, SUITE 200
POLSTER, LIEDER, ET AL.
ST. LOUIS, MO 63121
Assignment: 2
Reel/Frame:
024378/0587Recorded: 05/13/2010Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/06/2010
Assignee:
111 BUSINESS PARK DRIVE
UTICA, NEW YORK 13502
Correspondent:
MARK E. BOOKS
12412 POWERSCOURT DRIVE, SUITE 200
POLSTER, LIEDER, ET AL.
ST. LOUIS, MO 63131
Assignment: 3
Reel/Frame:
067387/0848Recorded: 05/13/2024Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/08/2024
Assignee:
6210 88TH STREET
SACRAMENTO, CALIFORNIA 95828
Correspondent:
G. HARLEY BLOSSER
120 S. CENTRAL AVE.
SUITE 1600
CLAYTON, MO 63105

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