Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/25/2014
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Application #:
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13949546
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Filing Dt:
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07/24/2013
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Publication #:
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Pub Dt:
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06/26/2014
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Inventor:
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Michael A. Tischler
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Title:
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WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| UNIT 1A - 3751 NORTH FRASER WAY |
| BURNABY, BRITISH COLUMBIA, CANADA V5J 5G4 |
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| BINGHAM MCCUTCHEN LLP |
| 2020 K STREET NW |
| WASHINGTON, DC 20006 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| UNIT 1A-3751 NORTH FRASER WAY |
| BURNABY, BRITISH COLUMBIA, CANADA V5J 5G4 |
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| MATTHEW T. CURRIE |
| BINGHAM MCCUTCHEN LLP |
| 2020 K STREET, NW |
| WASHINGTON, DC 20006 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 200 BAY STREET, SOUTH TOWER, ROYAL BANK PLAZA |
| SUITE 2210 |
| TORONTO, CANADA M5J 2J2 |
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| JENNIFER FITZPATRICK |
| C/O COOLEY LLP |
| 4401 EASTGATE MALL |
| SAN DIEGO, CA 92121 |
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