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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/02/2014
Application #:
13774209
Filing Dt:
02/22/2013
Publication #:
Pub Dt:
03/27/2014
Inventors:
Jung-min Ko, Won-keun Kim, Myun-sung Kang, Sang-sick Park, Ji-seok Hong
Title:
SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES, AND SYSTEMS INCLUDING SEMICONDUCTOR PACKAGES
Assignment: 1
Reel/Frame:
030088/0222Recorded: 03/26/2013Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/18/2013
Exec Dt:
02/18/2013
Exec Dt:
02/19/2013
Exec Dt:
02/18/2013
Exec Dt:
02/18/2013
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO
SUWON-SI, KOREA, REPUBLIC OF
Correspondent:
ONELLO & MELLO, LLP
THREE BURLINGTON WOODS DRIVE
SUITE 203
BURLINGTON, MA 01803

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