Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/09/2014
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Application #:
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13175362
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Filing Dt:
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07/01/2011
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Publication #:
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Pub Dt:
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02/23/2012
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Inventors:
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Bau-Ru LU, Kai-Peng CHANG, Da-Jung CHEN, Tsung-Chan WU
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Title:
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ELECTRONIC PACKAGE STRUCTURE HAVING SIDE-WING PARTS OUTSIDE OF A PACKAGE LAYER FOR DISSIPATING HEAT AND METHOD FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, R&D 2ND RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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| JOE MCKINNEY MUNCY |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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