Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/23/2014
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Application #:
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13312562
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Filing Dt:
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12/06/2011
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Publication #:
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Pub Dt:
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05/02/2013
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Inventors:
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Kah Wee Gan, Yaohuang Huang, Yonggang Jin
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Title:
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EMBEDDED WAFER LEVEL PACKAGE FOR 3D AND PACKAGE-ON-PACKAGE APPLICATIONS, AND METHOD OF MANUFACTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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28 ANG MO KIO, INDUSTRIAL PARK 2 |
SINGAPORE, SINGAPORE 569508 |
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HAROLD H. BENNETT II |
701 FIFTH AVE |
SUITE 5400 |
SEATTLE, WA 98104 |
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