Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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01/06/2015
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Application #:
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13988724
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Filing Dt:
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08/12/2013
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Publication #:
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Pub Dt:
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12/05/2013
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Inventors:
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Chunlin Xie, Xilin Su, Hongpo Hu, Wang Zhang
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Title:
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Substrate Structure, Method of Forming the Substrate Structure and Chip Comprising the Substrate Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PART B, 1/F BLDG#B2, YUCAN INDSTR. AREA, LANZHU RD |
| SHENZHEN EXPORT PROC ZN, SHENZHEN GRAND INDUST. ZN |
| SHENZHEN, CHINA 518118 |
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| 3009, BYD ROAD, PINGSHAN |
| SHENZHEN, CHINA 51118 |
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| DAVID D. BRUSH |
| 900 SECOND AVENUE SOUTH |
| SUITE 1400 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1, YAN'AN ROAD, KUICHONG STREET |
| DAPENG NEW DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518119 |
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| DILWORTH IP LLC |
| 2 CORPORATE DRIVE |
| SUITE 206 |
| TRUMBULL, CT 06611 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO. 1 YANAN ROAD, KUICHONG STREET |
| DAPENG NEW DISTRICT |
| SHENZHEN, CHINA 518119 |
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| SALIWANCHIK, LLOYD & EISENSCHENK |
| P.O. BOX 142950 |
| GAINESVILLE, FL 32614 |
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