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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/13/2015
Application #:
13714104
Filing Dt:
12/13/2012
Publication #:
Pub Dt:
01/23/2014
Inventors:
Hang Kyu CHO, Jae Yeol CHOI, Seok Hyun YOON, Young Ghyu AHN, Doo Young KIM, Ji Young PARK
Title:
LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND PACKING UNIT THEREOF
Assignment: 1
Reel/Frame:
029466/0129Recorded: 12/13/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/27/2012
Exec Dt:
11/27/2012
Exec Dt:
11/27/2012
Exec Dt:
11/27/2012
Exec Dt:
11/27/2012
Exec Dt:
11/27/2012
Assignee:
314 MAETAN 3-DONG, YEONGTONG-GU
SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001

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