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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	8946095	Issue Dt:	02/03/2015	Application #:	13660363	Filing Dt:	10/25/2012
Publication #:	20140120706	Pub Dt:	05/01/2014
Inventors:	LI Chen, Jyh-Nan Lin, Chin-Feng Sun, Po-Hsiung Leu, Ding-I Liu
Title:	METHOD OF FORMING INTERLAYER DIELECTRIC FILM ABOVE METAL GATE OF SEMICONDUCTOR DEVICE

Assignment: 1

Reel/Frame:

029785/0871

Recorded: 02/11/2013

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

CHEN, LI

Exec Dt:

01/29/2013

LIN, JYH-NAN

Exec Dt:

01/29/2013

SUN, CHIA-FENG

Exec Dt:

01/30/2013

LEU, PO-HSIUNG

Exec Dt:

01/30/2013

LIU, DING-I

Exec Dt:

02/04/2013

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

NO. 8, LI-HSIN ROAD 6

SCIENCE-BASED INDUSTRIAL PARK

HSIN-CHU, TAIWAN 300-77

Correspondent:

DUANE MORRIS LLP (TSMC) IP DEPARTMENT

30 SOUTH 17TH STREET

PHILADELPHIA, PA 19103-4196

Assignment: 2

Reel/Frame:

029802/0197

Recorded: 02/13/2013

Pages: 6

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE FIRST NAME OF THE THIRD ASSIGNOR TO READ "CHIN-FENG SUN", PREVIOUSLY RECORDED ON REEL 029785 FRAME 0871. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST..

Assignors:

CHEN, LI

Exec Dt:

01/29/2013