Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/10/2015
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Application #:
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12891088
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Filing Dt:
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09/27/2010
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Publication #:
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Pub Dt:
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03/29/2012
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Inventors:
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Mudasir Ahmad, Mohan R. Nagar, Weidong Xie
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Title:
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INTEGRATED CIRCUIT PACKAGE LID CONFIGURED FOR PACKAGE COPLANARITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 170 WEST TASMAN DRIVE |
| SAN JOSE, CALIFORNIA 95134-1706 |
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| EDELL, SHAPIRO & FINNAN |
| 1901 RESEARCH BOULEVARD |
| SUITE 400 |
| ROCKVILLE, MD 20850 |
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