Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/10/2015
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Application #:
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13676888
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Filing Dt:
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11/14/2012
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Publication #:
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Pub Dt:
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05/15/2014
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Inventors:
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Pei Hsing Hua, Hui-Shan Chang
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Title:
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METHOD FOR DICING A SEMICONDUCTOR WAFER HAVING THROUGH SILICON VIAS AND RESULTANT STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN 811 |
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| GEORGE D. MORGAN |
| 4635 S. LAKESHORE DR., SUITE 131 |
| TEMPE, AZ 85282 |
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