Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/17/2015
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Application #:
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13789411
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Filing Dt:
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03/07/2013
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Publication #:
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Pub Dt:
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12/12/2013
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Inventors:
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Guy F. Burgess, Shannon D. Buzard, Anthony P. Curtis, Douglas M. Scott
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Title:
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METHOD FOR APPLYING A FINAL METAL LAYER FOR WAFER LEVEL PACKAGING AND ASSOCIATED DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3701 E. UNIVERSITY DRIVE |
PHOENIX, ARIZONA 85034 |
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GREENBERG TRAURIG, LLP |
77 WEST WACKER DRIVE, SUITE 3100 |
C/O INTELLECTUAL PROPERTY DEPARTMENT |
CHICAGO, IL 60601 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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112 LONGTENG ROAD, ECONOMIC & TECHNICAL DEVELOPMENT ZONE |
KUNSHAN, JIANGSU, CHINA 215300 |
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GANG YU |
ACIP INTERNATIONAL, INC. 419 10TH ST, |
SF, CA 94103 |
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