Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/24/2015
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Application #:
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13900612
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Filing Dt:
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05/23/2013
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Publication #:
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Pub Dt:
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01/09/2014
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Inventors:
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Won-Keun KIM, Chang-Seong JEON, Gi-Jun PARK, Teak-Hoon LEE, Young-Kun JEE
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Title:
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SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| STANZIONE & KIM, LLP |
| 919 18TH STREET, NW |
| SUITE 440 |
| WASHINGTON, DC 20006 |
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