Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/14/2015
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Application #:
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13117110
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Filing Dt:
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05/26/2011
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Publication #:
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Pub Dt:
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07/05/2012
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Inventors:
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Yuan-Shun Tsai, Yu-Cheng Hsu
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Title:
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MOLD ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1F, NO.11, WUCYUAN 2ND RD., WUGU DIST. |
| NEW TAIPEI CITY, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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