Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/21/2015
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Application #:
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13860974
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Filing Dt:
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04/11/2013
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Publication #:
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Pub Dt:
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11/28/2013
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Inventors:
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Nikhil Vishwanath Kelkar, Jian Yin, Loyde Milton Carpenter JR.
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Title:
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METHOD OF MANUFACTURING A PACKAGED CIRCUIT INCLUDING A LEAD FRAME AND A LAMINATE SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1001 MURPHY RANCH ROAD |
| MILPITAS, CALIFORNIA 95035 |
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| FOGG & POWERS LLC |
| 5810 W 78TH ST |
| SUITE 100 |
| MINNEAPOLIS, MN 55439 |
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