Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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14011159
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Filing Dt:
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08/27/2013
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Publication #:
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Pub Dt:
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02/27/2014
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Inventors:
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Chang Bo LEE, Chang Sup RYU, Hyo Bin PARK, Cheol Ho CHOI
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Title:
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METHOD FOR FORMING SOLDER RESIST AND SUBSTRATE FOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-743 |
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STAAS AND HALSEY LLP |
1201 NEW YORK AVENUE, N.W. |
SUITE 700 |
WASHINGTON, DC 20005 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 035470 FRAME 0774. ASSIGNOR(S) HEREBY CONFIRMS THE SAMSUNG ELECTRO-MECHANICS CO., LTD..
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MAEYOUNG-RO 150 (MAETAN-DONG) |
YOUNGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-743 |
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STAAS AND HALSEY LLP. |
1201 NEW YORK AVE |
7TH FLOOR |
WASHINGTON, DC 20005 |
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