Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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14295577
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Filing Dt:
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06/04/2014
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Publication #:
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Pub Dt:
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12/11/2014
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Inventor:
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Yong-Kwan LEE
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129 SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE INVENTORS NAME PREVIOUSLY RECORDED ON REEL 033027 FRAME 0955. ASSIGNOR(S) HEREBY CONFIRMS THE SPELLING OF THE INVENTORS NAME SHOULD BE LISTED AS LEE, YONG-KWAN..
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| 129 SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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