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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/09/2015
Application #:
13934186
Filing Dt:
07/02/2013
Publication #:
Pub Dt:
01/09/2014
Inventors:
Dennis Tak Kit TONG, Vincent Wai Hung
Title:
WAFER-LEVEL PACKAGED OPTICAL SUBASSEMBLY AND TRANSCEIVER MODULE HAVING SAME
Assignment: 1
Reel/Frame:
030732/0573Recorded: 07/03/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/27/2013
Exec Dt:
06/27/2013
Assignee:
SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T.
HONG KONG, HONG KONG
Correspondent:
B.Y.I.P., LTD
P.O. BOX 1484, GENERAL POST OFFICE
HONG KONG, HONG KONG
Assignment: 2
Reel/Frame:
046569/0754Recorded: 07/18/2018Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/13/2018
Assignee:
3/F, SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T.
HONG KONG, HONG KONG
Correspondent:
B.Y.I.P., LTD
P.O. BOX 1484 OF GENERAL POST OFFICE
HONG KONG, HONG KONG

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