Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2015
|
Application #:
|
13913770
|
Filing Dt:
|
06/10/2013
|
|
Publication #:
|
|
Pub Dt:
|
12/11/2014
| | | | |
|
Inventors:
|
Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter Wilson, Yan Huo, Zhiqiang Niu, Ming-Chen Lu
|
|
Title:
|
HYBRID PACKAGED LEAD FRAME BASED MULTI-CHIP SEMICONDUCTOR DEVICE WITH MULTIPLE SEMICONDUCTOR CHIPS AND MULTIPLE INTERCONNECTING STRUCTURES
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 475 OAKMEAD PKWY, |
| SUNNYVALE, CALIFORNIA 94085 |
|
|
|
|
| CHEIN-HWA S. TSAO |
| 6684 MT PAKRON DRIVE |
| SAN JOSE, CA 95120 |
|
|
Search Results as of:
06/25/2024 08:39 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
