Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/23/2015
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Application #:
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14390982
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Filing Dt:
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10/06/2014
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Publication #:
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Pub Dt:
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02/26/2015
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Inventors:
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Sathid Jitjongruck, Anongnat Somwangthanaroj
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Title:
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METHOD AND ENCAPSULANT FOR FLIP-CHIP ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 560 MOO2, BANGPA-IN INDUSTRIAL ESTATE, UDOMSORAYUTH RD., T.KIONG-JIK, A. BANGPA-IN |
| AYUTTHAYA, THAILAND 13160 |
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| PHAYATHAI ROAD, PATHUMWAN |
| BANGKOK, THAILAND 10330 |
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| NOVICK, KIM & LEE, PLLC |
| 1604 SPRING HILL ROAD SUITE 320 |
| VIENNA, VA 22182 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED AT REEL: 034576 FRAME: 0661. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 560 MOO2, BANGPA-IN INDUSTRIAL ESTATE, UDOMSORAYUTH RD., T.KLONG-JIK, A. BANGPA-IN |
| AYUTTHAYA, THAILAND 13160 |
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| PHAYATHAI ROAD, PATHUMWAN |
| BANGKOK, THAILAND 10330 |
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| NOVICK, KIM & LEE, PLLC |
| 1604 SPRING HILL ROAD SUITE 320 |
| VIENNA, VA 22182 |
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