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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/23/2015
Application #:
14601215
Filing Dt:
01/20/2015
Publication #:
Pub Dt:
05/14/2015
Inventors:
Deok-young JUNG, Pil-kyu KANG, Byung-lyul PARK, Ji-soon PARK, Seong-min SON, Jin-ho AN et al
Title:
SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING THE SAME
Assignment: 1
Reel/Frame:
034779/0800Recorded: 01/21/2015Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/16/2014
Exec Dt:
07/16/2014
Exec Dt:
07/16/2014
Exec Dt:
07/16/2014
Exec Dt:
07/16/2014
Exec Dt:
07/16/2014
Exec Dt:
07/16/2014
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742
Correspondent:
RENAISSANCE IP LAW GROUP LLP (PIP)
9600 SW OAK STREET, SUITE 560
PORTLAND, OR 97223

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