Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/07/2015
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Application #:
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12964415
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Filing Dt:
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12/09/2010
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Publication #:
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Pub Dt:
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04/26/2012
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Inventors:
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Shih-Neng DAI, Chia-Tin CHUNG
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Title:
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MULTICHIP PACKAGE STRUCTURE FOR DIRECTLY ELECTRICALLY CONNECTING TO AN AC POWER SOURCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.37, LANE 37, KEJI 2ND RD., GUEISHAN TOWNSHIP, |
| TAOYUAN COUNTY, TAIWAN 33383 |
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| MUNCY, GEISSLER, OLDS & LOWE, PLLC |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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