Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/04/2015
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Application #:
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13107678
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Filing Dt:
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05/13/2011
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Publication #:
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Pub Dt:
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04/19/2012
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Inventor:
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Hsien-Wei CHEN
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Title:
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SEMICONDUCTOR CHIP HAVING DIFFERENT PAD WIDTH TO UBM WIDTH RATIOS AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| LOWE HAUPTMAN HAM & BERNER, LLP (TSMC) |
| 1700 DIAGONAL ROAD, SUITE 300 |
| ALEXANDRIA, VA 22314 |
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