Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/11/2015
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Application #:
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14167819
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Filing Dt:
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01/29/2014
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Publication #:
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Pub Dt:
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07/30/2015
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Inventors:
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Roland V. Gelder, Wei-Hsiao Chen, Chun-Hao Su, Tore Nauta
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Title:
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MEMS PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, ZILIAN RD., XINSHI DIST. |
| TAINAN CITY, TAIWAN 74148 |
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| J.C. PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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