Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/08/2015
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Application #:
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14506455
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Filing Dt:
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10/03/2014
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Inventors:
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James M. Holden, James S. Papanu, Wei-Sheng Lei, Brad Eaton, Ajay Kumar
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Title:
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BI-LAYER WAFER-LEVEL UNDERFILL MASK FOR WAFER DICING AND APPROACHES FOR PERFORMING WAFER DICING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| JUSTIN K. BRASK |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085-4040 |
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