Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/08/2015
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Application #:
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14156617
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Filing Dt:
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01/16/2014
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Publication #:
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Pub Dt:
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05/15/2014
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Inventors:
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R. Scott West, Tao Tong, Mike Kwon
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Title:
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Packaging Photon Building Blocks Having Only Top Side Connections In A Molded Interconnect Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 PORTOLA AVENUE |
| LIVERMORE, CALIFORNIA 94551 |
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| IMPERIUM PATENT WORKS |
| P.O. BOX 607 |
| PLEASANTON, CA 94566 |
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